The Center consists of approximately 15,000 sq ft. of space, of which approximately 3,500 sq ft. is certified Class 100 (ISO Class 5) and 300 sq ft. of Class 10 (ISO Class 4) clean room space, a high capacity ultra pure water system, an automated wastewater neutralization system, chemical storage bunkers, a mechanical shop, gas storage space, and a semiconductor grade Liquid/Gas N2 distribution system. At the present time, there is plenty of space for future capabilities along with space available to potential outside clients.
The Class 100 clean room capabilities:
- Photolithography: UV/DUV alignment/exposure tools for substrates up to 6" in diameter including infrared backside alignment capability. UV Blanket exposure system for low resolution patterning. Solvent hood and acid/base hoods, spin coaters and spin rinse dryers.
- Deposition: LPCVD Silicon Nitride, Low Temperature Oxides and an ALD tool.
- Thermal oxidation and anneal: Furnaces that will handle up to 5" substrates.
- Plasma etching: Low power ash cleaning and reactive ion etch (RIE) as well as ICP tools.
- Metrology: Includes 4 pt probe, ellipsometer, step profiler, Raman spectroscopy, CT X-Ray, microscope and probe station.
- Thin Films: e-beam and thermal evaporator, sputter PVD deposition and parylene coater.
- Packaging: wafer dicing saw and wire bonders.
- The chase area containing facilitation requirements: acid and solvent exhaust, easy access to power, nitrogen, UPW and city water, drains to the neutralization system, space for vacuum pumps, etc.
The facility has ultrapure water purification equipment and a 2,000-gallon Halar-lined dynamic storage tank. A wastewater neutralization system controls the effluent streams from the cleanroom and chase areas prior to discharge into the waste stream.
The 2,000-gallon liquid nitrogen storage tank provides high-purity liquid and gaseous N2 to the Center.
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